· Semiconductor wafer inspection
· Surface and bump inspection
· Electronics manufacturing
· 3D solder paste inspection
· Package and bump inspection
· Automated Optical Inspection (AOI)
· Solar panel inspection
· General machine vision
· And more!
Family | Genie Nano |
---|---|
Partnumber | G3-XM30-M5105 |
Resolution | 26.2 Megapixel |
Resolution(H*V) | 5120 x 5120 pixel |
Sensor | Onsemi Python 25k |
Sensor size(Image Circle) | 32.58 mm |
Sensor Format(Inch) | APS-H |
Turbodrive Frame Rate | |
Frame Rate | 80 fps |
Pixel Size | 4.5 μm |
Interface | CoaXPress (CXP-6) |
Chroma | Mono |
Readout Method | Global |
Dynamic Range | 55.3 dB |
Sensor type | CMOS |
Mount | M42 |
Size | 59 x 59 x 32 mm |
Maker | Teledyne Dalsa |